CES – 2018 is prudently cementing the virtual future of innovations and technology to reality. Visitors today are not just peppy about smart consumer electronics but the enablers of these smart technologies. From automotive to smartphones, semiconductor companies like Infineon, STMicroelectronics, Microchip, Texas Instruments, Renesas, Maxim and ON Semiconductors have elevated the innovative decorum of the show. With the growing interest of core electronics among visitors, the semiconductor giants have successfully effectuated to keep the visitors on the edge. This year at CES 2018(January 9 to January 12 in Las Vegas) semiconductor giants are probably connecting the digital atmosphere as electrified electronics rules the show.
A compilation of innovative solutions duly accolades the semiconductor giants as they keep visitors on fancy:
- Fueling the future at CE Infineon Disrupts Wireless Charging for Automotive and Consumer Applications
Infineon Technologies showcased one of its premier flexible chip sets for high performance including software IP for smart and safe wireless charging applications.
The Infineon XMC microcontroller provides a powerful and cost-effective platform. The scalable architecture can support everything from a fast charge smartphone, to a 20 W robot, up to a 60 W drone and beyond. Paired with power products, like MOSFETs and Driver ICs, this system can provide full power wireless charging without complicated thermal management, often achieving charging rates equivalent to wired charging.
- STMicroelectronics Smart Driving and the Internet of Things (IoT) Turned Heads at CES – 2018
ST to show its latest silicon technologies and solutions for the next generation of applications in the broad IoT market and mobility platforms and services. ST is enabling Smart Driving and applications for the Smart City, Smart Home, Smart Industry, and Smart Things of today and tomorrow. Use cases focus on key consumer and industrial technologies including AR/VR/MR, Voice Control, Imaging, Artificial Intelligence, Wireless Charging, Solutions for Industrial Condition Monitoring and Predictive Maintenance, Safety, Connected Technologies, and Services for Mobility
- CES 2018: Qualcomm unveils smart home hub collaboration with Google
At CES 2018, Qualcomm and Google announced a new collaboration that aims to put the Google Assistant into more devices around the home.The collaboration includes two Qualcomm Home Hub platforms based on the SDA624 and SDA212 system on chips that support Google’s Android Things.
- ON Semiconductor’s AR0430 Image Sensor Recognized at CES 2018
ON Semiconductor is driving energy efficient innovations, during the show ON semiconductor announced a new 1/3.2-inch Back Side Illuminated (BSI) 4 Megapixel (MP) CMOS digital image sensor. The AR0430 delivers 120 frames-per-second (fps) performance supporting slow-motion video in 4 MP mode. CMOS digital image sensor addressing applications including IoT, AR/VR and security cameras is selected as a 2018 CES Innovation Awards Honoree.
- Intel’s new core processors with AMD graphics
The company revealed the eighth generation of core processors that feature discrete graphics from their long-time rival, AMD. This collaboration will make way for incredibly thin and light laptops and PCs that will provide impressive gaming performance and 4K media streaming.
- NovAtel technology showcased at CES 2018 with Renesas Electronics
NovAtel technology with Renesas Electronics Corporation demonstrates high integrity and accurate positioning solutions for autonomous driving, ADAS, connected car feature demonstrations and automotive solutions. NovAtel and Renesas are currently collaborating on implementing NovAtel’s high-performance GNSS+INS positioning solution with the Renesas R-Car H3 system-on-chip (SoC). The R-Car H3 is compliant with the ISO 26262 functional safety standard for automotive applications, which aligns with NovAtel’s automotive strategy.
- Texas Instruments Highlighted New Automotive Headlight Technology
Sought to be available in second half of 2018, Texas instruments has developed a new technology called DLP for high-resolution automotive headlight systems. The solution took the center-stage of this year’s CES-2018.
- Cypress Semiconductors Automotive Chipset Makes Noise at CES – 2018
Cypress Semiconductor also announced a new WiFi combo chipset targeted at automotive applications. Car connectivity gets increasingly common-place and users enjoy the same media experience they experience at home, and there’s the need for vehicle manufacturers to keep up with the ever-evolving technology landscape such as new WiFi standards.
- Molex and Microchip Powered Fabricates the Future of Automotive Infotainment Systems
Molex and Microchip Technology collaboratively showcased the development of integrated USB Media Modules and USB Power Delivery Solutions for automotive infotainment systems.The Molex CES 2018 booth puts demonstrations of USB Media Modules and Power Delivery Solutions. It also brought Microchip’s USB devices which are optimize USB Power Delivery functionality, reducing overall BOM costs by architecting a total system solution that can be easily designed into a single module.
- Maxim Integrated ‘Design’ Electronics Innovation at CES 2018
At the Consumer Electronics Show (CES) in Las Vegas, Nevada (January 9-12, 2018), Maxim Integrated Products demonstrated how it is empowering design innovation through its high-performance mixed signal and analog solutions.Maxim will showcase technologies and provide demonstrations within several applications, including – Automotive, Healthcare, Mobility etc.
CES is getting bigger and semiconductor giants have evidently shown their strong-arm to embark innovations to foster and feed the future of innovations in the global-ready digital and connected world.