AIOT Camera Modules for Advanced Applications
Mouser Electronics has announced a global distribution agreement with Xvisio Technology.
According to the agreement, Mouser will offer customers Xvisio’s integrated sensor fusion SeerSense™ AIOT camera modules for advanced applications, including AR/VR head-mounted display (HMD), drones, industrial automation, 3D face recognition, and 3D scanning.
The SeerSense XR50 module from Xvisio features an independent vSLAM computing unit without the need for host intervention, making it easy to connect to AR/VR and robotic devices. The XR50 module boasts low power consumption and is housed in a compact 75 mm × 14 mm × 8.9 mm package, providing an ideal solution for space-constrained applications. The module offers multiple working modes via USB 2.0 and optional Bluetooth® 5.0 connectivity. The device can be customized for different baseline and ID requirements for design flexibility.
The SeerSense™ DS80 module features both passive stereo semi-global block matching (SGBM) and active time-of-flight (ToF) depth engines on a single device, providing a comprehensive solution for vSLAM, depth, vision AI, and computer vision (CV) edge computing. The product includes a 13 MP RGB camera, dual 2 MP fisheye cameras, VGA ToF camera, high performance IMU, a USB Type-C™ port and extension GPIO port. With strong on-board computing engines, the SeerSense DS80 can offload host resource loading and minimize the power consumption. Xvisio also offers feature-rich SDKs and tool kits for rapid development, allowing designers to leverage advanced machine perception capabilities quickly.
“Xvisio Technology has been dedicated to spatial perception and human-machine interaction technology for years,” said John Lin, the President and CEO of Xvisio Technology. “We are enthusiastic about partnering with Mouser Electronics to roll out our products to the industry worldwide for both fast proof of concept development and volume production,”
