Alliance Memory to Exhibit its Lineup at Embedded World 2022
On display at Embedded World 2022, Alliance Memory's latest offering for the embedded market includes 4GB and 8GB industrial-grade embedded multi-media card (eMMC) solutions for solid-state storage in consumer, industrial, and networking applications.
Alliance Memory has declared its technology lineup for Embedded World 2022, taking place June 21-23 in Nuremberg, Germany.
Exhibiting in Hall 1, Stand 639, the company will highlight its latest SRAM, DRAM, flash, and storage memory ICs for embedded platforms.
“It’s been more than two years since Alliance Memory has exhibited at an in-person trade show,” said David Bagby, President and CEO of Alliance Memory. “During that time, we’ve been proudly supporting the European market with a reliable source of legacy memory chips that were otherwise in short supply, especially our Micron Technology flash devices, which we’ve been able to keep in stock due to our special relationship with the company. But the long wait is finally over, and we’re excited to meet up with our valued distributors and customers again at Embedded World 2022. We can’t wait to see everyone in Nuremberg.”
On display at Embedded World 2022, Alliance Memory’s latest offering for the embedded market includes 4GB and 8GB industrial-grade embedded multi-media card (eMMC) solutions for solid-state storage in consumer, industrial, and networking applications.
The devices each integrate NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5mm by 13mm 153-ball FBGA package. Compliant with the JEDEC eMMC v5.1 industry standard, the eMMCs support features such as boot operation, replay protected memory block (RPMB), device health report, field firmware updates, power-off notification, enhanced strobe features for faster and more reliable operation, write leveling, high-priority interrupt (HPI), secure trim/erase, and high-speed HS200 and HS400 modes.
Alliance Memory will also be highlighting high-speed CMOS mobile low-power SDRAMs featuring on-chip ECC.
To meet the growing demand for serial peripheral interface (SPI) NAND flash memory products in the automotive, industrial, communications, and consumer electronic markets, Alliance Memory will be exhibiting its AS5F series of 1.8V to 3V devices with densities from 1Gb to 8Gb and high-speed clock frequencies up to 120MHz.
Offering reliable, long-term performance, the SPI NAND flash products feature more than 60,000 program/erase cycles, offer 10-year data retention, and support standard, dual, and quad SPI operation. With their enhanced performance, the devices meet the requirements for multimedia data storage applications and AI implementation.
In addition, Alliance Memory will showcase its AS25F line of 3V multiple input/output serial NOR flash memory products, which are designed to provide supply continuity for Micron Technology customers utilizing discontinued N25Q series devices.
