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alpitronic Picks Infineon’s Modules & Drivers for its Hypercharger

By using the CoolSiC technology, the HYC50 achieves up to 97 percent efficiency and enables a bidirectional design.

alpitronic has released the state-of-the-art and industry-leading 50 kW DC electric vehicle charger HYC50, using EasyPACK CoolSiC MOSFET 1B and 2B modules from Infineon in combination with EiceDRIVER X3, following the successful launch of the HYC150 and HYC300 of their hypercharger product line.

alpitronic Modules Hypercharger“We are committed to working closely with customers like alpitronic to help them realize unique designs enabling superior system solutions,” said Peter Wawer, President of the Industrial Power Control Division at Infineon. “In addition to comprehensive system expertise and many years of experience, we offer first-class solutions such as our portfolio of EasyPACK 1B and 2B modules with the latest 1200 V CoolSiC MOSFET technology to increase the efficiency as well as the power density. The devices can be flexibly combined with suitable drivers to meet the requirements of each customer and their project.”

“With Infineon’s CoolSiC EasyPACK modules in combination with a perfect matching driver IC, we were able to significantly improve the efficiency of our new hypercharger,” said Philipp Senoner, co-founder and managing director of alpitronic. “We are therefore very pleased to have Infineon as a reliable and competent partner at our side, providing a wide range of CoolSiC MOSFET, gate drivers and the necessary understanding of our specific requirements.”

By using the CoolSiC technology, the HYC50 achieves up to 97 percent efficiency and enables a bidirectional design. As a result, this hypercharger is suitable for vehicle-to-grid (V2G) operation.

In this particular design, Infineon’s EasyPACK 1B and 2B modules, which include CoolSiC MOSFETs, an NTC temperature sensor, and PressFIT contact pins, we’re able to increase power density by about 50 percent. In addition, by using CoolSiC technology, the noise level was significantly reduced from 65 dB to less than 50 dB.

Besides the necessary power devices, Infineon also provided the matching drivers. The X3 driver IC is particularly suitable for the modules in this design, offering many decisive advantages through its configurability and active and passive monitoring options.

Furthermore, the operating points in the field can be optimized by OTA (Over-the-Air) updates – these can also influence the parameters in the gate driver. Thereby, systems in different climates can be optimized for the corresponding environmental conditions.


Aishwarya Saxena

A book geek, with creative mind, an electronics degree, and zealous for writing.Creativity is the one thing in her opinion which drove her to enter into editing field. Allured towards south Indian cuisine and culture, love to discover new cultures and their customs. Relishes in discovering new music genres.

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