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System-in-package (SiP) is an increasingly important package type that comprises a variety of assembly materials and processes that minimizes volume, without sacrificing computational intensity. This market is mostly being driven by mobile Internet of Things (IoT) devices, such as smartphones and smartwatches. Materials deposition techniques, especially solder paste printing, are also changing to match this need. The development of ultra-fine solder powders and solder pastes began in the late 1990s, as the standard flip-chip assembly process of wafer/under bump metallization (UBM) solder bump, onto solder-on-pad (SoP) on the substrate became strongly established. |
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