ASM Presents SIPLACE CA for Advanced Packaging
ASM has introduced SIPLACE CA, one of the ASM placement platforms that are ideal for Advanced Packaging applications.
They can flexibly place bare dies directly from the wafer with classic feeder-based SMT placement.
Besides being the world’s first platform that combines chip assembly and SMT placement in a single machine, it ensures that for every placement you’re doing, there’s process traceability.
Semiconductor companies have always relied on the standards of SECS/GEM for optimizing their semiconductor manufacturing. SECS/GEM provided a generic communication interface between machines and systems and allow easy access to data such as Status Data Collections, Trace Data Collection, Alarms Management, as well as machine control such as Spooling, Remote Command.
Typically for a flip-chip or placement equipment, these standards are used to do remote control (offline, online, remote command), select and download recipes for products; error or alarm notification, and for traceability data collection.
For the SIPLACE CA, this also includes single component traceability data which provides information on which component from which feeder/wafer is placed on which substrate, at what location, and at which date/time stamp.
Taking this one step further, in addition to component traceability, SIPLACE CA provides a process data interface (PDI) via OIB which means that this can also be collected using the SECS/GEM interface.
What is PDI? This is a series of information on more than 40 process attributes per placement position as the placement process is happening.
This process attributes range from:
- Pickup eg actual pick position, pickup location id
- Dipping eg result, timestamp
- Measurement eg result (any deviations), camera ID
- Placement eg actual place position, reference designator, vacuum values
