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Testing Electronic Design Automation in 2018

EDA design systems are changing with new critical smart technologies like IoT uproars in the semiconductor market. The emergence of system-in-package (SiP) technology has enabled mixed-signal SoC manufacturers to provide the single chip with more functionality at a moderate price.

Testing Electronic

The global electronic design automation market is expected to be highly concentrated by the end of 2022. As the global electronic design automation market is expected to reach USD 11 billion during the period 2018-2022.  According to Global Electronic Design Automation Market 2018-2022 report, one of the major drivers for this market is rising adoption of SoC technology. The global electronic design automation market is expected to be highly concentrated by the end of 2022. Vendors in this market space are competing based on factors such as technology, research and developmental activities, labor, and brand. Moreover, players in the EDA market are also focusing on differentiating their products based on innovation, regulatory compliance, and quality of the products.
“Systems and IP will be the watchwords in 2018 as the semiconductor design ecosystem advances from chip-centric (integration of transistors) design to system-centric (integration of functional blocks) design,” predicted Bob Smith, executive director of the Electronic System Design Alliance (ESDA). He notes that “the move from chip-centric design to system-centric design is happening, and commercial products in the system design automation segment are starting to emerge. Another example of system-centric design is IP morphing into chiplets or hardened IP that’s characterized and tested before SoC design begins.”

Growing Design Complexity to Improve Functionality

The semiconductor market is defined by the need for high functionality, performance, and bandwidth. Thus, semiconductor device manufacturers should enhance their offerings in terms of performance and functionality. They must also ensure that they maintain the time to market to gain an advantage over their competitors. The increasing complexity of semiconductor chip designs has further increased the manufacturing complexity.

According to a senior analyst at Technavio for semiconductor equipment research, “The features and functionalities provided by consumer electronic devices are increasing as electronic device manufacturers are concentrating on differentiating their offerings. Semiconductor device manufacturers have addressed this need by developing new and more complex architectures and designs such as the advent of 3D architecture and MCMs.”

SoC Image

SoC Technology Gets Omnipresent

A large number of manufacturers are integrating their devices such as smartphones, automotive body electronics, telemetry devices, wireless communication equipment, and electrocardiogram (ECG) with SoC technology.

The emergence of system-in-package (SiP) technology has enabled mixed-signal SoC manufacturers to provide the single chip with more functionalities at a moderate price. The need for semiconductor devices is increasing in terms of capacity and speed. This in turn, will propel the popularity of SoC technology. This creates a need for electronic design automation (EDA) software because they ensure that the chip designs are in line with requirements. They also ensure the precision required in the design.

The launch of 4G networks in several countries such as India and China has resulted in the deployment of long-term evolution technology (LTE). This technology has a significant impact on the smart devices market, leading to exponential growth of smartphones, tablets, and wearables with 3G and 4G connectivity.

The electronic design automation market is witnessing considerable growth in the on-premise deployment model because on-premise software provides data execution across many business units, functions, or product lines. According to our analysts, the on-premise segment will account for the maximum share of the EDA market throughout the next few years.

The latest trend gaining momentum in the market is shift from perpetual to subscription licensing model. One of the major factor limiting the growth of the EDA market is the high capital investments. The provision of EDA tools based on the subscription license model allows end-users to create a mix of desired EDA tools. End-users are eligible to receive upgrades and maintenance facilities for a specific time period.

Minituarized Design

Design for High-Precision, Miniaturized Electronic Devices

There is an increase in the demand for compact electronic devices from almost all sectors, including communication devices, automotive, industrial manufacturing, and healthcare equipment. This has encouraged semiconductor IC manufacturers to increase their R&D expenditure to reduce the size of the ICs and enhance their performance. This has led to the emergence of MEMS and 3D semiconductor devices. ICs have become denser over the last decade. MEMs and 3D ICs have an increasing number of interconnects and transistors integrated into them. These ICs require finer deposition and patterning. Chip manufacturers have migrated from planar field-effect transistor designs to fin-shaped FET architecture designs.

IoT and EDA Design

Hot IoT Giving Chills to EDA Design

Internet of things is a catch 22 for many engineering projects today. Most IoT applications are prototypes and proof of concepts (PoC) designed to justify enterprise budget increases and follow-on venture investment rounds. Modern products must be equipped with a system that allows the end device to be linked to many other systems. A typical example is the automobile auto driving system, which is not only about cars but also involves various services of our society and daily lives. When designing a smart car, engineers must think about the car itself while also considering how this car will be able to receive and treat communication data sent by its surroundings.Today, QCD is applied to all components of a given device.One of the challenges of integrating software in a device is its dependence on exterior elements. The functional safety issues for the products are getting more and more important. Security will be a core component for these devices. Custom circuits implemented specifically for security will be implemented. Eventually, there will be a consensus about how to do this, but few companies are ready to roll their own until the full security software stack is understood.

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