Electrolube has recently developed and launched a brand new silicone resin specifically for the Indian market. Formulated at the company’s manufacturing facility in Bangalore, the new resin has been produced using locally sourced materials to ensure highly competitive pricing and short lead times.
Utilizing group technical support and key local knowledge, Electrolube said that its Indian team identified local customer requirements in terms of budgetary restraints and production methodologies, and created a brand new alternative Dow Corning’s CN-8760.
The SC4003FD offers higher specifications than existing products on the market and also carries the full seal of approval from the UK parent company for quality and innovation compliant with internationally recognized standards.
The new resin not only delivers on affordability and the lead time but also offer customers excellent, high-performance alternatives to existing brands. The innovative encapsulation resin from Electrolube is a thixotropic, and versatile two-part silicone resin designed for the protection of electronic devices such as LED lighting drivers, electrical control units, sensors, inverters, transformers and power modules.
The Key Properties of the SC4003FD include:
- Flexible Silicone Resin
- Excellent Moisture resistance
- Thixotropic with good flow characteristics
- Room temperature cure, no ovens required
- Wide temperature range (-60°C to +200°C)
- Good thermal conductivity(0.9 W/m.K)
- Simple 1:1 mix ratio,
- Excellent adhesion to a wide range of substrates
- Black Silicone Resin
- RoHS Compliant
Electrolube India’s General Manager, Padmanabha Shaktivelu, added, “This innovative new resin solution is a prime example of Electrolube’s dedicated approach to solving problems. As a company we employ a strong ethos of both research and collaboration; we are continually developing new products, not only to ensure that the product is cost-effective and right for the job but also to advise and help our customers choose the safest, most appropriate and economical method of application.”
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