The growing advanced packaging technology of semiconductors to grow $8.9 billion by 2022
Global 3D semiconductor packaging market size is expected to grow $8.9 billion by 2022, a growth CAGR of 15.7% from 2016 to 2022.
The growing advanced packaging technology of semiconductor chips in which two or more layers of active electronic components are stacked together and interconnected vertically as well as horizontally to perform as a single device.
This technology possesses various advantages over other advanced packaging technologies such as reduced space consumption, decreased power loss, better overall performance, and enhanced efficiency.
A special feature of 3D packaging design that distinguishes it from other advanced packaging methods is that it mounts the die on top of each other unlike side-by-side mounting of 2D packaging, which consecutively acquires less space, and results in the formation of more compact chips and aids the growing demand for circuit miniaturization.
Furthermore, overall less cost of as compared to other advanced packaging technology options gives an edge and fuels its adoption in memory chip stacking, I/O DRAMS, and high bandwidth applications. The need for miniaturization of memory chips, high bandwidth requirements in electronic circuits, and reduced cost than other advanced packaging technologies are prime factors, which foster the demand in 3D packaging industry.
The need to control the chip designing cost, which plays a major role in overall price of electronic devices; increase in demand for miniaturized circuits; and short replacement period of electronics products, which are constituted of integrated circuits manufactured with 3D packaging technology are the major factors that drive the growth in the 3D semiconductor packaging industry.
However, high cost required to establish a 3D semiconductor packaging facility hinders the growth opportunities in 3D semiconductor packaging industry and this is anticipated to grow the overall 3D semiconductor packaging market size to three folds of the current value. On the contrary, the growth in trend of Internet of Things (IoT) and increase in number of wireless devices are opening new opportunities which will increase 3D semiconductor packaging market share in overall advanced packaging market. The ongoing 3D semiconductor packaging market trends suggest that the market will witness a double-digit growth in next five to six years.