EPSON to Participate at PACK EXPO Connects 2020

Epson America will be participating at  PACK EXPO Connects virtual trade show from Nov. 9-13, demonstrating leading robot and labeling technology solutions for a wide variety of automation applications.

Epson will also be presenting on the “Innovation Stage” during the virtual event. The session, “Automation 201 – Clarifying Your Requirements for Project Success,” will leave attendees with business-ready insights based on Epson’s nearly four decades of experience and leadership in industrial robotics.

Epson will be exhibiting at the virtual packaging trade show, offering one-on-one video meetings and product demonstrations with technical experts. In addition, Epson’s Scott Marsic will provide both new and experienced automation professionals with insight and understanding around core automation requirements and their associated performance trade-offs.