eYs3D Microelectronics, a silicon-centric fabless design house enabling enhanced computer vision for edge AI, has raised $7 million in Series A funding from strategic partners ARM IoT Capital, WI Harper Group and MARUBUN CORPORATION.
The funding will allow eYs3D to grow its new product development for AI-based autonomous operation, including robotics, security, touchless control, autonomous vehicles and smart retail.
“With this investment and with high demand for new computer vision capabilities across many sectors, we are well-poised to capture market share as we migrate to full 3D vision depth sensing,” said James Wang, eYs3D’s Chief Strategy Officer. “We are well along with our roadmap in the AI-enabling market, and we are excited to continue our journey with our partners and investors that will allow eYs3D to move more computer vision products into the market.”
“As we look to the future, enhanced computer vision support plays a key role in ARM’s AI architecture and deployment,” said Peter Hsieh, Chairman of the ARM IoT Fund. “eYs3D’s innovative 3D computer vision capability can offer the market major benefits, and we are pleased to partner with the company and invest in the creation of more AI-capable vision processors.”
The company will demonstrate its 3D depth-sensing cameras and vision sensor integration solutions today at the virtual 2021 Embedded Vision Summit as a member of the Edge AI and Vision Alliance. The company will showcase sensor use cases that permit new capabilities in object recognition, distance measurement and more.
The investors bring important relationships and expertise to the company: ARM will work with eYs3D to focus on the integration of its chips with ARM’s CPU/NPU processors; WI Harper Group is a pioneering cross-border venture capital firm that will offer eYs3D access to its large industrial partners base and ecosystem; and MARUBUN CORPORATION is joining the funding round to open up new distribution channels for the company to deploy its solutions to businesses worldwide.
eYs3D designs processor ICs for AI at the edge. The technology allows for more sophisticated human/machine coordination.
To address specific growing markets such as artificial intelligence of things (AIoT) and mobile intelligence, eYs3D uses a unique silicon design approach with algorithms to integrate and manage information from differing sensor sources including thermal, active 3D sensing and neural network perception.