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Fujitsu Successfully Develops Adhesive Sheet Technology with High Thermal Conductivity

Fujitsu Laboratories Ltd.  has recently announced the development of the world’s first adhesive sheet composed of carbon nanotubes with extremely high thermal conductivity of up to 100 W/mK.

FujitsuCarbon nanotubes have high thermal conductivity and represent a promising candidate for heat dissipation from heat sources including semiconductor devices. Nevertheless, the material remains difficult to handle due to its fragility, rendering it impractical for many purposes.

To address this, Fujitsu has successfully developed a technology for laminating vertically aligned carbon nanotubes, while maintaining their original characteristics of high thermal conductivity and flexibility, as well as a technology for bonding them with sufficient adhesion. This technology facilitates the cutting and handling of carbon nanotube sheets, making it possible to use them as a heat dissipation material, for example, in automotive power modules for electric vehicles (EVs).

Fujitsu aims to license the use of its newly-developed carbon nanotube adhesive sheets to companies in the materials and electrical industries, and will continue to support their use in a variety of commercial applications.

Background and Development

EVs are increasingly being put to practical use as efforts to regulate greenhouse gases accelerate throughout the world. Despite this, the fact that EVs are more expensive than gasoline-powered vehicles and lack similar driving ranges continues to hinder their widespread adoption. In order to improve the cost-performance and driving range in recent years, efforts have been made to develop semiconductor devices that use silicon carbide or gallium nitride as an alternative material to the more commonly-used silicon to reduce the size, weight, power consumption, and cost of power modules for electric vehicles.

In order to make this a reality, however, countermeasures to deal with heat generated around semiconductor devices due to module miniaturization must be resolved, and components such as heat dissipation materials and bonding materials that make up modules must be designed to achieve unprecedented levels of heat resistance and thermal conductivity.

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Nitisha Dubey

I am a Journalist with a post graduate degree in Journalism & Mass Communication. I love reading non-fiction books, exploring different destinations and varieties of cuisines. Biographies and historical movies are few favourites.

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