Hitachi High-Tech Corporation has developed its Electron Beam Area Inspection System GS1000.
This newly developed tool offers precise and fast e-beam inspection by using a common platform, which is based on proven Hitachi High-Tech’s high-speed inspection SEM’s, Hitachi High-Tech’s expertise in market-leading CD-SEM technology, and high-speed and massive measurements.
Demand for cutting-edge semiconductor devices mass-production is being drastically increased, driving the introduction of EUV Lithography to enable smaller semiconductor devices.
Hitachi High-Tech is contributing to the increased productivity in the modern semiconductor industry by providing a fast e-beam GS1000 system to facilitate massive metrology over a wide inspection area.
Shrinking of semiconductor device nodes is continuing with cutting-edge device manufacturers introducing EUV technology, which is capable of quick and extremely precise lithography. The device manufacturers are beginning to utilize this technology in the mass production of 5nm node devices and the development of 3nm node devices.
As circuit pattern dimensions manufactured using EUV lithography are approximately half of the size of those produced by ArF lithography, systems that can inspect and measure these smaller patterns reliably, accurately and in a repeatable manner have become essential to managing production lines and yields.
Particularly, quality assurance of advanced EUV masks to reduce variations in circuit dimensions and randomly occurring microscopic stochastic defects characteristic of EUV lithography becomes of utmost importance.
Consequently, the need for high-throughput, high-resolution inspection and measurements is increasing in line with the expansion of many inspection targets.
Hitachi High-Tech is responding to this increased demand for high-speed, sensitive inspection and measurements over a wide area and is launching the GS1000 system to fulfill the needs of the semiconductor device mass-production market.