IESA signs MoU with Asia Semiconductor Trading Support Association (ASTSA) to strengthen Indo-Japan ESDM industry collaborations
Ahead of Japan’s Prime Minster pivotal visit to India, India Electronics and Semiconductor Association (IESA) and Asia Semiconductor Trading Support Association (ASTSA) has inked a MoU to foster the ESDM ecosystem, jointly create stronger ties between India and Japan creating business opportunities.
In an aim to ratify bilateral business relations, The MoU would enable IESA and ASTSA to promote ESDM ecosystem in Indian and Japan and strengthen business relationship among the member companies. The engagement would also provide an opportunity to the member companies of the both the associations to jointly work towards a mutually beneficial activity in the ESDM landscape and empower knowledge exchange and sharing among them.
Commenting on the collaboration, M. N. Vidyashankar, President, IESA said, “Japan has already established itself as a global leader in the ESDM landscape. India is gaining momentum to establish its identity in the space and we believe, the MoU will help both the nations to expand bilateral trade.”
“India is emerging as the fascination for many global ESDM leaders primarily due to its mature market, availability of talents and the expertise India can bring to the ESDM supply chain with components like designing, embedded system, VLSI etc. We believe India’s ESDM industry is at an inflection point and the MoU can only strengthen our commitment towards each other” said Dr. Hajime Tomokage, President ASTSA (Asian Semiconductor Trading Support Association)
Delegation led IESA, visited Japan to identify key areas of doing business, extend collaborations for the Indo-Japan ESDM industry.
Delegates will also visit JETRO (Japan External Trade Organisation), Fukuoka and an event on Embedded Technology at Yokohama, Japan to involve exclusive B2B interaction.