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IESA-TiE Bangalore inks MoU with TSSC at IoTNext 2016

IESA-TiE Bangalore
(From left to right): Arvind Tiwary, Co-Chair, IoTNext, Naganand Doraswamy, President, TiE Bangalore, Lt Gen (Dr) SP Kochhar, AVSM,SM,VSM (Retd) CEO, TSSC, K Krishna Moorthy, Chairman, IESA, Kumaran Venkatesh, Vice President – Strategy and Operations at IESA, start-up mentor & advisor, Co-Chair IoTNext.

Amid second edition of the flagship event, IoTNext 2016 – India Electronics and Semiconductor Association (IESA) with The Indus Entrepreneurs (TiE), Bangalore and TSSC have settled a MoU for opening a Center of Excellence (CoE) in Bangalore.

The MoU was represented by Lt Gen (Dr) SP Kochhar, AVSM,SM,VSM (Retd) CEO, TSSC, Naganand Doraswamy, President, TiE Bangalore and K Krishna Moorthy, Chairman, IESA, Corporate Vice President & Managing Director, India Design Center Rambus Chip Technologies India Pvt. Ltd.

Kick-started under the theme, ‘Realities and the Road Ahead’; this year the event was packed with industry thought leaders, startups and stakeholders in the IoT sector. The platform known to mentor around 16 startups since its inception and amongst which Cardiac Design Labs won Google LaunchPad Award with proven success of the mentored startups to work with them to turn their dreams to reality.

TSSC, IESA and TiE, the CoE aims to help in providing a platform to skill, develop and train blue collared workers in the field of IoT. It will empower the group to focus on gaining competency using some of the best practices and help in creating job opportunities for them as the industry shifts towards automation.

The main objective of the COE is to prepare the current workforce to be industry-ready in the coming years.

The event included keynotes addressed by distinguished speakers including, Marc Carrel-Billiard, Managing Director of Global Technology R&D, Accenture, Shalini Kapoor, Distinguished Engineer, CTO – IoT Ecosystem Solutions, IBM, Munesh Makhija, Vice President – GE India Technology Centre Pvt. Ltd & CTO – GE South Asia and Madhav Narayan, Senior Director, Business Strategy, Intel Technology India highlighted the exciting new opportunities of IoT in the country with the evolving business environment, innovative strategies involving IoT in use and the industry roadmap.

At the summit, TiE-IESA also launched a unique IoT Start up directory, which is a compilation of startups working in the field of IoT across the nation. The directory will be an online repository with detailed information on the startups and the unique products and services they offer.

In addition, TiE- IESA has also joined hands with HAX Accelerator, a hardware startup accelerator to support Indian startups.

Speaking on the occasion, M N Vidyashankar, President, IESA said, “It is our great pleasure to bring forth IoTNext again this year. As an industry body, it is our responsibility to create a platform to share disruptive ideas and catapult them into reality. With the support of some of the biggest global innovators such as IBM, Intel and General Electric, we have been able to bring together some of the brightest minds in the industry to share their insights.” He further added, “The MoU signed today with TSSC ensures that blue collared workers will be able to adopt to the benefits of IoT instead of being left behind. The Centre of Excellence will have skill training specially curated for this task force so that they can develop their knowledge further and become industry ready”

Naganand Doraswamy, President, TiE Bangalore, said, “Both TiE and IESA are proud to present the second edition of IoTNext. With aggressive focus by the Indian Government on ‘Digital India’, ‘Smart Cities’ and ‘Make in India’ to drive the growth and development of the nation, the MoU signed today will provide further impetus for the growth of the IoT ecosystem. With the rise in technological innovations, many workers lose out on opportunities as there is a huge gap between their skills and what is expected of them. The Center of Excellence will provide them with these necessary skills and bridge the gap.”


BiS Team

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