Indium Corporation Expert Presentation at CSPT 2019
Indium Corporation’s Leo Hu, Area Technical Manager, will center-stage his presentation at the China Semiconductor Packaging Testing and Marketing Conference (CSPT 2019) September 8-10, in Wuxi, China.
Hu’s presentation, Novel Water-Soluble Flux Study for Heterogeneous Integration Assembly, will detail a high-viscosity, high-tack flux designed to be used to secure components at the placement and reflow stage allowing the flux residue to be cleaned. Hu will also present the characteristics and strengths of the developed flux, WS-446HF, including its excellent wetting, low voiding performance, and elimination of dendritic residues.
Hu is based in Suzhou, China, and has nearly 15 years of experience in semiconductor packaging. He is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. He has served in many roles at top 10 outsourced assembly and test (OSAT) companies, including Process Engineer, Project Engineer, Senior R&D Engineer, and Chief Engineer. Hu earned his bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
Further Info on Indium Corporation’s Materials for Heterogeneous Integration: Click here
