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Indium Corporation Expert Presentation at CSPT 2019

Indium Corporation’s Leo Hu, Area Technical Manager, will center-stage his presentation at the China Semiconductor Packaging Testing and Marketing Conference (CSPT 2019) September 8-10, in Wuxi, China.

Leo Hu
Leo Hu, Indium Corporation’s, Area Technical Manager

Hu’s presentation, Novel Water-Soluble Flux Study for Heterogeneous Integration Assembly, will detail a high-viscosity, high-tack flux designed to be used to secure components at the placement and reflow stage allowing the flux residue to be cleaned. Hu will also present the characteristics and strengths of the developed flux, WS-446HF, including its excellent wetting, low voiding performance, and elimination of dendritic residues.

Hu is based in Suzhou, China, and has nearly 15 years of experience in semiconductor packaging. He is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. He has served in many roles at top 10 outsourced assembly and test (OSAT) companies, including Process Engineer, Project Engineer, Senior R&D Engineer, and Chief Engineer. Hu earned his bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.

Further Info on Indium Corporation’s Materials for Heterogeneous Integration: Click here


Niloy Banerjee

A generic movie-buff, passionate and professional with print journalism, serving editorial verticals on Technical and B2B segments, crude rover and writer on business happenings, spare time playing physical and digital forms of games; a love with philosophy is perennial as trying to archive pebbles from the ocean of literature. Lastly, a connoisseur in making and eating palatable cuisines.

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