Indium Corporation: Leading Innovation in Electronics & Sustainability
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. During an interaction with Vidushi, Ross Berntson, President and COO, of Indium Corporation, provided erudite notions of the company, highlighting how it will shape the future of the global electronics assembly industry.
Could you share some insights into the journey of Indium Corporation over the past 90 years, highlighting significant milestones and innovations along the way?
The Indium Corporation story started in 1934 in Utica, New York, where we are still headquartered today. Driven by scientific curiosity, our founder, William S. Murray, identified and enabled the first commercially viable applications for indium metal. Over the past 90 years, that sense of curiosity has continuously fueled innovations in materials science, and we are tremendously proud of that legacy. In the early 1940s, our indium metal was used in Studebaker automobile bumpers. A decade later, we developed a commercially viable process to manufacture precision solder preforms, allowing for the mass production of alloy-junction transistors. In the 70s, we began developing solder pastes, which remains one of Indium Corporation’s core pillars today. In the 90s, we introduced innovations like InFORMS® reinforced solder preforms and NC-SMQ92J, a no-clean solder paste that would quickly emerge as an industry standard. In the 2000s, Indium Corporation ushered in innovations in solder alloy technology, thermal interface materials (TIMs), and semiconductor packaging materials. Today, we are proud to be considered a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, with facilities in India, China, Germany, Malaysia, Singapore, South Korea, the United Kingdom, and the United States.
Indium Corporation has been recognized for its contributions to various industries, including electric vehicles, mobile devices, and 5G technology. What do you believe sets your soldering solutions apart from competitors in these markets?
Our engagement with the global industry, and long-standing commitment to Research and Development (R&D), has allowed us to foresee industry trends and respond with timely, highly innovative solutions. For example, our SiPaste® series of fine powder pastes and no-clean fluxes have proven instrumental in addressing the trend of miniaturization as the demand for increasingly compact and efficient devices necessitates smaller, lighter, and more powerful components. We have also successfully drawn on the power of our experience. Drawing on more than 60 years of manufacturing gallium-based liquid metals, our high-performance liquid metal-based TIMs with advanced knowledge and expertise are supporting growing needs in high-performance computing for AI and IoT. Perhaps most importantly, our products are backed by industry-leading technical support and consultation. We pride ourselves on being more than a materials supplier or manufacturer but a partner to increase our customers’ productivity and profitability through the design, application, and service of our advanced materials.
Sustainability is becoming increasingly important in the electronics industry. How does Indium Corporation integrate sustainability into its operations and product development processes?
Governments and companies are taking active steps to reduce their carbon footprints, showing that it is vital to adopt energy-saving processes and sustainable practices to remain competitive in the international marketplace. Our product portfolio and company practices directly reflect our commitment to environmental sustainability. Durafuse® LT, part of our Durafuse® technology umbrella, is a novel, lead-free solder paste mixed alloy system that enables low-temperature soldering and energy savings while ensuring high reliability. This innovative material has been shown to reduce energy consumption by up to 15 percent, compared to a typical Pb-free solder paste, by reducing the temperature of the reflow oven—saving energy and cost on every printed circuit board. Our recently introduced Indalloy®301 LT is another novel alloy technology, specifically designed for power module package-attach applications, which enables lower processing temperatures in preform soldering. Its bismuth-free composition, lower processing temperatures, and diverse configurations make it a versatile solution for evolving manufacturing needs. We are also proud of our unique Reclaim & Recycle programs for indium, gallium, germanium, and tin metals, and a program for recycling solder and solder dross.
Could you elaborate on some of the recent partnerships and memberships Indium Corporation has joined? How do these collaborations benefit the company’s objectives and the industry?
We are committed to playing a leadership role in the future of the global electronics assembly markets, and to that end, we strive to participate in efforts that push the entire industry forward. In the last year alone, we have joined several international associations, including the India Electronics and Semiconductor Association (IESA). We are proud to have local supply in India that will benefit the Make in India campaign, and this strategic involvement positions us to support the region’s growing need for consumer and infrastructure electronics, such as electric vehicle (EV) manufacturing, mobile, 5G, and semiconductors. Our industry thought leaders are very active within their respective communities and areas of expertise, regularly presenting at conferences throughout the year and across the globe. They are also involved in developing industry standards through work with organizations like SMTA and IPC. For example, our Global Head of e-Mobility and Infrastructure, Brian O’Leary, currently serves as chair of the IPC EV Quality & Reliability Advisory Group.
Indium Corporation has received numerous awards for its products and innovations. Can you highlight a few key technologies or solutions that have received notable recognition and their impact on the market?
We don’t do our work for public accolades, but let’s face it – it is always encouraging to be recognized by the industry. Within the past year, we’ve been honored with CIRCUITS ASSEMBLY’s New Product Introduction Award, EM World’s Innovation Award, IEEE Malaysia’s Outstanding Industry Award for Innovation, Electronics Maker’s Best of Industry Award for Best Soldering Product of the Year, two global technology awards from global SMT and packaging in flux and adhesive/underfills/ encapsulants categories, Mexico EMS’ Mexico Technology Award for solder paste, and SMTA’s Technical Distinction Award was bestowed upon our very own Dr. HongWen Zhang.
Community engagement and philanthropy are integral aspects of Indium Corporation’s values. Can you discuss some specific initiatives or projects the company has undertaken to support STEM education, workforce development, and charitable causes?
Just as we believe that materials science changes the world, we believe that today’s students will build our future. To that end, we are committed to bolstering community educational resources, especially those that advance the promise and vitally important work in the STEM fields. Through partnerships with schools, universities, and community organizations, it is estimated that we impact the lives of more than 5,000 students annually. Specifically, we offer an award-winning college internship program that has launched the careers of over 100 college students in STEM fields since 2012. We also offer an apprenticeship program and assistance to support employees learning new skills and pursuing degree programs.
As the industry evolves rapidly, what are Indium Corporation’s key areas of focus for research and development?
As this industry advances around us on a seemingly day-by-day basis, we are investing heavily in R&D to create advanced materials that align with the evolving needs of Industry 4.0. Our materials, from smart factories to IoT-enabled devices, are designed to enhance connectivity, performance, and reliability.
Looking ahead, what is the vision for Indium Corporation’s role in shaping the future of the global electronics assembly industry?
I genuinely believe that Indium Corporation’s best days are ahead of us, which makes me very excited for the future. We have some of the most incredible minds and leaders in the industry, and by preserving our unique culture, I am confident we will continue to attract top talent to help us continue our legacy of innovation. Our 90th-anniversary milestone is a testament to the incredible work and dedication of our team members across the globe and the trust of our customers. An occasion like this provides a valuable opportunity to reflect on our achievements and celebrate our current successes while envisioning a future enriched by our materials science.
“Our engagement with the global industry, coupled with a long-standing commitment to R&D, has allowed us to foresee industry trends & respond with timely, highly innovative solutions. “
