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Indium Corporation Rollsout InFORMS ESM02 for Die-Level Bonding

Indium InFORMSIndium Corporation has launched InFORMS ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications.

Indium Corporation’s InFORMS ESM02 is a reinforced solder fabrication that produces a high-reliability solder joint with increased thermal and mechanical performance.

Until recently, InFORMS technology was only applied at the baseplate level. New production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS include:

  • Drop-in replacement for other bondline control methods
  • Increased lateral strength
  • Bondline co-planarity
  • Improved thermal cycling reliability
  • Available in ribbon and preforms

Further Info About Indium Corporation: Click here 

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Niloy Banerjee

A generic movie-buff, passionate and professional with print journalism, serving editorial verticals on Technical and B2B segments, crude rover and writer on business happenings, spare time playing physical and digital forms of games; a love with philosophy is perennial as trying to archive pebbles from the ocean of literature. Lastly, a connoisseur in making and eating palatable cuisines.

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