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Indium Corporation to Feature Proven NC-SMQ75 Die-Attach Solder Paste at CSPT 2018

indiumIndium Corporation will feature its Die-Attach “Power-Safe” NC-SMQ75 Solder Paste at China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21 in Hefei, Anhui, China.

Indium NC-SMQ75 is an ultra-low residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable residue.

NC-SMQ75’s unique formulation has been proven in demanding high-reliability applications, and features:

  • Ultra-low post-reflow residue <0.5% w/w of solder paste
  • “Power-Safe” residue compatible with overmolding compounds without delamination
  • Consistently good wetting with common metal finishes
  • Dispenses without clogging for powder types 3, 4, 5, and 6
  • Wide range of alloy compatibility, including high-Pb alloys

Along with NC-SMQ75, Indium Corporation has a wide array of proven die-attach products to cater to multiple applications, such as system-in-package, flip-chip, and more.

Further info on Indium Corporations New NC-SMQ75: Click Here

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Niloy Banerjee

A generic movie-buff, passionate and professional with print journalism, serving editorial verticals on Technical and B2B segments, crude rover and writer on business happenings, spare time playing physical and digital forms of games; a love with philosophy is perennial as trying to archive pebbles from the ocean of literature. Lastly, a connoisseur in making and eating palatable cuisines.

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