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Indium Corporation to Flaunt Indium8.9HF Solder Paste at Productronica China

Indium8.9HF Solder PasteIndium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at Productronica China, March 20-22, in Shanghai, China.

The Indium8.9HF Series:

  • Air reflow, no-clean solder paste suite specially formulated to accommodate the higher processing temperatures required by the SnAgCu (SAC), SnAg, and other alloy systems favored by the automotive electronics industry.
  • 9HF series delivers no-clean halogen-free solder paste solutions designed to produce low-voiding and improved stability during the printing process.

The Series Also:

  • Demonstrates consistent printing and reflow performance for up to 12 months in refrigerated storage
  • Maintains excellent printing and reflow performance after remaining at room temperature for one month
  • Delivers excellent response-to-pause printing performance, even after being left on the stencil for 60 hours

Indium8.9HF enhances the reliability of automotive products in two ways:

  • Increases electrical reliability via enhanced surface insulation resistance (SIR) that inhibits current leakage and dendritic growth
  • Improves thermal reliability due to its low-voiding performance on bottom terminating components (BTCs), reducing the risk of application or product failure

Further info About Indium8.9HF Solder Paste: Click here

Indium at Productronica China, March 20-22, in Shanghai, China: Booth #E2.2514 at the show.


Niloy Banerjee

A generic movie-buff, passionate and professional with print journalism, serving editorial verticals on Technical and B2B segments, crude rover and writer on business happenings, spare time playing physical and digital forms of games; a love with philosophy is perennial as trying to archive pebbles from the ocean of literature. Lastly, a connoisseur in making and eating palatable cuisines.

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