Indium’s expert Dr. Lee to present at IMPACT-IAAC 2019
Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will present at IMPACT-IAAC 2019, Oct. 23-25, Taipei, Taiwan.
Dr. Lee will present Novel Fluxes with Decreased Viscosity After Reflow for Flip-Chip and SiP Assembly. He will explain the development of fluxes for flip-chip and SiP assembly. These high-viscosity, high-tack fluxes are designed to be used to secure components at the placement and reflow stage allowing the flux residue to be cleaned.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has more than three decades in the development of fluxes, alloys and solder pastes for SMT industries and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives.
In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with “Best of Conference” awards.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets.
Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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