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Indium Expert to Present at APEC 2022

This product, Durafuse™ HT, has shown the feasibility as a drop-in solution to replace high-lead solders for die-attach in power discrete applications by delivering improved performance.

Indium Corporation has reported that its expert HongWen Zhang will be presenting on the development of a novel high-temperature lead-free solder for die-attach in power discrete applications at APEC 2022, March 20-24, Houston, Texas, U.S.

Indium Expert APEC 2022The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-lead solders for die-attachment and clip-bond in power device applications.

In his presentation, DurafuseTM HT—A Drop-in High-Temperature Lead-Free Solution that Outperforms High-Pb Solders in Power Discrete Applications, Zhang examines a new formulation of Indium Corporation’s innovative material Durafuse™—a novel design based on a mixed-alloy technology—designed to deliver an Sn-rich HTLF paste, presenting the merits of both constituent alloys.

This product, Durafuse™ HT, has shown the feasibility as a drop-in solution to replace high-lead solders for die-attach in power discrete applications by delivering improved performance.

Zhang is the manager of the Alloy Group within Indium Corporation’s Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high-reliability applications.

He and Ning-Cheng Lee invented the mixed-alloy solder technique that combines the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control a joint’s morphology, thus improving reliability.

Based on this technique, the Durafuse LT, BiAgX, and Durafuse HT solder systems were invented to meet market needs. Zhang has published more than 20 papers and journal articles.

He received his Ph.D. in materials science and engineering, as well as a master’s degree in mechanical engineering from Michigan Technological University.

He holds a Lean Six Sigma Green Belt and is a certified IPC specialist for A-600 and IPC-A-610D, and is a Certified SMT Process Engineer.

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Aishwarya Saxena

A book geek, with creative mind, an electronics degree, and zealous for writing.Creativity is the one thing in her opinion which drove her to enter into editing field. Allured towards south Indian cuisine and culture, love to discover new cultures and their customs. Relishes in discovering new music genres.

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