Indium Corporation has announced that Thuy Nguyen, technical support engineer, will host a webinar on modern no-clean solder pastes and whether they provide comparable electrical reliability to those that require residue removal, as part of the company’s free webinar program, the InSIDER Series, at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/6 p.m. Germany on Wednesday, Nov. 17.
Certain high-reliability pockets of the electronics industry—including telecommunications, defense, aerospace, and medical—place a high value on the cleanliness of the finished PCBA.
For many modern applications that adapted to rosin-based, no-clean solder pastes and fluxes, the ingrained practice of cleaning for the sake of flux residue removal has lived on for a myriad of reasons.
Due to miniaturization and other trends (such as lower standoffs), new no-clean solder pastes and fluxes are being developed with a higher requirement on Surface Insulation Resistance (SIR) to ensure electrical reliability without cleaning off the residue.
However, have the enhanced properties of modern formulations mitigated the need to clean? Join Nguyen as she analyzes tests (conducted with the J-STD-004B SIR test method) performed with some new no-clean solder pastes to get the answer.
Nguyen is a technical support engineer based at Indium Corporation’s global headquarters. She is responsible for providing technical assistance to resolve soldering process-related issues.
This includes assisting customers with optimizing their use of Indium Corporation’s soldering materials, as well as providing product and process training to current and potential customers.
Nguyen joined Indium Corporation in 2015 and has held roles in Quality, R&D, and Manufacturing during her time with the company. She has contributed to multiple large-scale projects and assisted in the implementation of new processes and training materials.
She earned a bachelor’s degree in chemistry from Utica College in Utica, N.Y., USA.