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Indium Experts to Share Insights at DPC 2021

Indium Corporation has declared that three experts from their company will be sharing their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from April 12-15.

From left to right: Andy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Materials Applications; Sihai Chen, Research Chemist; and Evan Griffith, Product Specialist.

In Thermal Interface Materials in the HPC Era”Andy Mackie, Ph.D., MSc, Principal Engineer and Manager, Thermal Interface Materials Applications, will discuss how metallic thermal interface materials are providing low thermal resistance, high reliability, and flexibility for advanced compute modules and systems, in both TIM1 (die-lid), TIM2 (lid-heat-sink) and TIM0 (1.5) (die to heat-sink) applications.

 In Pressure-Less Silver Sintering Paste for Die-Attach on Bare Copper Surface Using Conventional Reflow Oven under Nitrogen Atmosphere”Sihai Chen, Research Chemist, presents the development of new silver sintering pastes where die can be attached on a bare Cu surface and processed using a reflow oven under nitrogen atmosphere. Chen will also study the joint strength obtained under different profiles, as well as substrate differences, and methods to reduce voids in silver sintering joints. 

In “Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous Integration Assembly”, Evan Griffith, Product Specialist, will review critical parameters for the printing of SiP paste. Multiple parameters that are important for SiP paste printing applications will be discussed, such as the metal load optimization, paste rheology, and metal powder size, type, and quality.

Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication, and assembly materials and processes.

Chen specializes in silver sintering paste product development and has authored several of Indium Corporation’s patents for silver sintering paste, thermal interface materials, heat-dissipating paint, and indium bump bonding.

He has been published in many of the world’s leading scientific journals, including the Journal of the American Chemical SocietyNano LettersLangmuir”, and The Journal of Physical Chemistry”, and he has also been a reviewer for some of these publications. Chen obtained his doctorate in chemistry from the Chinese Academy of Sciences with a focus on metal and semiconductor nanomaterial synthesis.

Griffith is a Product Specialist for SEMI/SAAM fluxes and SiPaste materials. He is based at Indium Corporation’s global headquarters. He is responsible for researching and analyzing customer and market data and facilitating current and prospective customers’ needs.


Aishwarya Saxena

A book geek, with creative mind, an electronics degree, and zealous for writing.Creativity is the one thing in her opinion which drove her to enter into editing field. Allured towards south Indian cuisine and culture, love to discover new cultures and their customs. Relishes in discovering new music genres.

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