Indium Corporation has recently started featuring the award-winning Durafuse LT–the novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications during Productronica China, held March 17-19 in Shanghai, China.
Durafuse LT is one of several products in Indium Corporation’s wide portfolio that meet the evolving needs of mobile and computing applications.
Patent-pending Durafuse LT is designed to provide high-reliability in low-temperature applications that need to reflow below 210°C.
Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse LT provides superior drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
- Provides a solution for heat-sensitive components and flex polymers
- Prevents thermal warpage of processor components and multilayer boards
- Meets low-temperature requirements for step soldering, particularly in RF shield attachment, post underfill processes and rework applications
From paste to wire, flux, and preforms, Durafuse LT joins a long list of Indium Corporation’s products that are specifically engineered to support the challenges of automotive electrification.