Indium Corporation has announced that Claire Hotvedt, product development specialist, will present on low-temperature solders for printed circuit board (PCB) assembly at the SMTA Boise Expo & Tech Forum at 1 p.m. on Tuesday, April 5 in Boise, Idaho, U.S.
Low-temperature solders are already valuable process tools in the modern PCB assembly industry.
However, high indium- and high bismuth-containing materials have drawbacks in regards to temperature sensitivity and mechanical shock reliability. Novel mixed alloy solder technology provides mid-to-high temperature solder properties while reducing reflow temperatures to 200℃.
In her presentation, Hotvedt will give attendees a better understanding of the new mixed-alloy solder process and capabilities, sharing how new industries can now take advantage of the multi-step processing and material sets enabled by low-temperature solder.
Hotvedt is a product development specialist for the PCB assembly business unit based at Indium Corporation’s global headquarters. She is responsible for facilitating the transition of new solder paste products from developmental stages into fully launched and marketable solutions.
Hotvedt also oversees product characterization and the creation of marketing materials to assist the sales team. Before joining Indium Corporation in 2018,
Hotvedt held engineering positions at Orthogonal, Inc. and Bristol-Myers Squibb. She earned her bachelor’s degree in chemical engineering, with a minor in Mandarin Chinese, from the University of Rochester, N.Y.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets.
Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil.
Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.