Anson Yu, Regional Sales Manager for Eastern and Northern China, Indium Corporation has shared that he will present company’s diverse portfolio of soldering solutions for the MiniLED market at the Mini LED Backlight Mass Production and Application Trend Conference, Thursday, July 28 in Shenzhen, China.
In Indium Corporation’s MiniLED Welding Solutions, Yu will discuss the company’s variety of materials solutions for MiniLED applications, ranging from water-wash, no-clean, and solvent-clean products and solutions, including pastes, alloys, flux, and tacky fluxes.
These solutions include Indium Corporation’s new NC-38HF LED solder paste, which can be used with Type 6 to Type 8 powders, so customers can choose the best fit for their applications amid the ongoing chip miniaturization trend of LEDs, which demand new printability and solderability requirements.
Yu has more than 10 years of manufacturing and equipment engineering experience. He earned his bachelor’s degree in electrical engineering from Nanjing Institute of Technology and his master’s degree in business administration from Wuhan University. He has earned a Flextronics global automation certification and is a certified Flextronics Lean Green Belt as well as business unit six sigma mentor.