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Indium Corporation to Feature Indium8.9HF Solder Paste Series at CEIA Xiamen

Indium Corporation will show customers how to Avoid the Void with its void-reducing Indium8.9HF Solder Paste series at CEIA Xiamen on November 14 in Xiamen, China.

Indium 123Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process.

Under optimal process conditions, this solder paste series:

  • Exceeds all requirements for enhanced electrical reliability and SIR performance
  • Delivers excellent response-to-pause, even after being left on the stencil for 60 hours
  • Maintains excellent printing and reflow performance after remaining at room temperature for one month
  • Demonstrates consistent printing performance for up to 12 months when refrigerated
  • Resists premature flux spread to prevent surfaces from oxidizing
  • Performs with both Pb and Pb-free alloys
  • Meets HKMC MS184-01 testing criteria Type B—one of the automotive industry’s most stringent reliability criteria

The Indium8.9HF series provides a unique oxidation barrier technology that eliminates HIP defects and graping, making these solder pastes perfectly suited for automotive and electronics assembly applications.

For more information, click here

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Nitisha Dubey

I am a Journalist with a post graduate degree in Journalism & Mass Communication. I love reading non-fiction books, exploring different destinations and varieties of cuisines. Biographies and historical movies are few favourites.

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