Infineon has introduced contact-less payment innovation, SECORA Pay with Coil-on-Module (CoM) package which comes with a newly developed antenna, specifically designed for cards made from recycled ocean plastic or wood.
It is the industry-wide thinnest payment module with a copper wire antenna, which allows cost-efficient card manufacturing for mass deployment.
“Infineon’s Coil on Module technology is one of the most important innovations for contact-less and dual interface payment cards,” said Bjoern Scharfen, who heads the product line Payment & Ticketing Solutions at Infineon. Communication between the chip module and card antenna is based on a radio frequency (RF) link, no electrical connection is required.“By using CoM, our chip solutions can be easily integrated into contact-less cards made of different materials. Manufacturers can flexibly and cost-effectively change their card designs and offer consumers sustainable, long-lasting products.”
CPI Card Group is already deploying Infineon’s SECORA Pay solution for its new range of eco-friendly plastic cards. “Using the Infineon SECORA Pay solution enabled CPI to bring Second Wave, our payment card that features a core made of recovered ocean-bound plastic to market quickly. The combination of inductive coupling antennas and chips made scaling this sustainable eco-focused payment card an efficient process”, said Guy DiMaggio from CPI.
Infineon’s SECORA Pay solutions use inductive coupling to connect the chip module with the card antenna, which results in many advantages for card manufacturers and users.
The payment chip modules have a thickness of only 0.32mm and are thus up to 50 percent thinner and up to 70 percent lighter compared to other solutions available in the market.
Consequently, the CoM module provides higher flexibility concerning card construction while the new antenna design based on the state-of-art copper wire is easier to embed into all known inlay sheet materials including recycled ocean-bound plastic. Moreover, there is also no need for additional adhesive elements during the card lamination process.
Finally, CoM technology makes cards more robust and helps to meet the increasing demand for contact-less solutions: with CoM, contact-less cards can be produced on standard equipment for contact-based cards without making new investments in specific machinery.