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Infineon, Schweizer Electronic Develop Innovative New Technology

Infineon Technologies along with Schweizer Electronic have developed a new technology for the mild-hybridization of cars: chip embedding for Power MOSFETs. The technology aims to significantly improve the performance of 48 V systems while reducing their complexity. Infineon also announced that Continental Powertrain will be the first player to adopt the technology.

Infineon Technologies
With chip embedding, the Power MOSFETs are no longer soldered onto a circuit board but integrated within. This allows a significantly higher power density and improvements in system reliability.

“Embedding Power MOSFETs will open a new chapter of possibilities for the electrification of mild hybrid cars,” said Rolf Merte, CEO at Schweizer Electronic. “The fact that one of the world’s leading automotive suppliers has chosen our technology confirms its potential.”

With chip embedding, the Power MOSFETs are no longer soldered onto a circuit board but integrated within. ”The resulting thermal benefits allow a higher power density and board integration enables further improvements in system reliability,” said Frank Findeis, who is heading Infineon’s automotive MOSFET business. “These advantages result in a higher power or more cost-effective 48 V systems.”

As a first application, Continental Powertrain has decided to implement the new technology in a 48 V starter generator for vehicles from a major European carmaker.

“Chip embedding allows us to increase electrical power by 60 percent compared to a traditionally designed system,” said Dietmar Vogt, System Technical Project Leader at Continental Powertrain.

48 V starter generators are a key contributor to the CO2 reduction of up to about 15 percent achieved by a mild hybrid vehicle compared to a conventional drive train. They allow the engine to be stopped more often and for a longer duration than a 12 V based start-stop-system. Furthermore, they can boost acceleration and thus reduce load on the combustion engine. During braking, they recover more of the kinetic energy than a 12 V system.

Infineon contributes its MOSFET technology OptiMOS 5 to the new approach and Schweizer its embedding power PCB technology called Smart p² Pack.

The partners plan to start mass production in 2021.

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Jyoti Gazmer

A Mass Comm. graduate believes strongly in the power of words. A book lover who dreams to own a library some day. An introvert but will become your closest friend if you share mutual feelings about COFFEE. I prefer having more puppies over humans.

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