Infineon’s New Compact Power Modules Meets Standards while delivering Higher Power Density
Infineon Technologies rolls out its latest power module family HybridPACK Double Sided Cooling (DSC) for hybrid and electric vehicles at the PCIM 2016 tradeshow. Coming in compact form of 42 mm x 42.4 mm x 4.77 mm, the new modules target HEV applications such as main inverters and generators with a typical power range of 40 to 50 kW. In order to support higher power, they can be used in parallel configurations.
In order to meet CO2 regulations worldwide by 2020, electric or hybrid vehicles (HEV) has become the best option today. With stringent targets of emission restricting to only 95 gram CO2 per kilometer in Europe, 121 g/km in the US, 117 g/km in China and 105 g/km in Japan, the electrifying of existing cars has become a challenge. As the inverter has to be placed in the typically cramped engine department, it has to be as small as possible. Inverter size is mainly defined by the power modules employed. Consequently, these have to become smaller while at the same time providing sufficient power to actuate the electric drivetrain. The size of a power module, on the other hand, is defined by the power consumption of the power chips used inside, and the ability to cool these chips to stay below a maximum junction temperature.
Addressing the needs, while tested the new modules with only 15 nH, the stray inductance is very low while blocking voltage was increased to 700 V supporting the development of inverter systems with reduced switching losses of about 25 percent and very high efficiency.
Complemented with integrated isolation, the module can be directly attached to a cooler without external isolation thus simplifying system integration. Each integrated IGBT chip is equipped with an on-chip current sensor for overcurrent protection. In addition, an on-chip temperature sensor provides derating and fast shut-off in case of over-temperature. The direct and precise sensing improves system monitoring. It also helps to simplify the functional safety architecture of automotive system suppliers and car manufacturers.
By combining double sided chip cooling with electrical isolation of the heat sinks, the thermal resistance RthJC of the HybridPACK DSC is significantly reduced to 0.1 Kelvin/Watt (K/W). In comparison, today’s power module HybridPACK 1 has a thermal resistance of 0.12 K/W. The HybridPACK DSC module technology also improves the electrical performance. Stray inductance is one major parameter, defined by module size and the careful routing of the current path through the module. The HybridPACK DSC value of only 15 nH is about 40 percent lower compared to reference modules. The result is a reduction of switching losses by 25 percent.
Availability of HybridPACK DSC power modules
The first member of the HybridPACK DSC family is the FF400R07A01E3_S6 implementing ICnom of 400 A and VCES of 700 V in half-bridge configuration. Engineering samples will be available in September 2016. A further product in the family implementing ICnom of 200 A and VCES of 700 V in a full-bridge configuration will be offered as engineering samples in October 2016. Further variants featuring different power ranges are under development.
At the PCIM 2016 tradeshow (Nuremberg, Germany, May 10-12, 2016), one can get a hands-on experience of the Infineon’s solutions at booth #412 in hall 9.