iWave Systems has introduced iW-RainboW-G40M: The solderable i.MX 8M Plus OSM LGA Module, build on the new industry standard “Open Standard Module (OSM)” defined by SGeT.
iW-RainboW-G40M integrates the powerful i.MX 8M Plus processor in the compact OSM 1.0 standard, delivering powerful AI and Machine learning capabilities on a compact edge device.
“i.MX 8M Plus powered OSM provides an ideal mix of small form factor, pricing, and scalability making the module an attractive option for product designers,” said Ahmed Shameem M H, Hardware Project Lead at iWave Systems.” The module provides designers a flexible and scalable option for their product while shortening their up time to market.
The OSM Standard defines a standard for a module to be soldered on the carrier board as a solder-on module LGA package, instead of relying on edge or board-to-board connectors.
The module is built on a 45 mm x 45 mm “Size-L” Standard, provisioning for 662 contacts. The OSM LGA Size-L Standard, measuring 45mm x 45mm, is 28% smaller than the µQseven (40mm x 70mm), a standard also hosted by SGeT, and 51% smaller than SMARC (82mm x 50mm).
Two image signal processors (ISP’s) and a dedicated neural network processor at up to 2.3 TOPS make the i.MX 8M Plus is an ideal fit in Smart Home, Smart City, Industrial IoT and beyond with its Machine learning, vision, and advanced multimedia capability.
Key Features of the Module
- i.MX 8M Plus Dual/Quad/Quad Lite
- 2GB LPDDR4 (Up to 8GB)
- 16GB eMMC (Up to 64GB)
- Wi-Fi (802.11 b/g/n/ac/ax)
- Bluetooth 5.0
- 2 * CAN-FD Ports
- 2 * RGMII Interfaces
- PCIe 3.0 x 1
- LVDS * 2
- Size-L LGA Module
Through a development kit and a production-ready SOM, you can accelerate your time to market with reduced risk. The module is application-ready and comes with all necessary software drivers and BSPs with software support of Ubuntu, Android and Linux.