Koh Young to Exhibit 3D Inspection Systems at SEMICON Taiwan 2021
Koh Young will highlight 3 products for in-line 3D inspection solutions for advanced package and mini/micro-LED manufacturing.
Koh Young has announced that the company will participate in SEMICON Taiwan 2021 at the TaiNEX1 from December 28-30, 2021 in Taipei, Taiwan.
Koh Young will exhibit solutions at booth J2234 (Floor 1).
We will highlight 3 products for in-line 3D inspection solutions for advanced package and mini/micro-LED manufacturing:
- Meister S: Premium In-Line 3D Inspection Systems for Ultra-thin Solder Paste Inspection
- Market-proven Ultra-thin Solder Inspection: The Meister S has been qualified for mass production by major semiconductor foundries and micro-LED companies for solder inspection down to 10um with superior Full 3D inspection performance.
- Superior Flux Inspection: Combining innovative vision algorithms and high-resolution optics for the semiconductor industries, the Meister S goes beyond solder paste inspection. It is a proven solution for flux inspection.
- Meister D+: Premium 3D Inspection Systems for Highly Reflective Die Surface
- Highly Reflective Die Inspection: The Meister D+ combines Moiré technology and new optics to support 3D inspection of highly reflective dies (mirror surface). The Meister D+ is the first-in-line 3D SiP inspection solution using an integrated measurement tool with defect analysis software based on advanced optics and AI engines.
- Neptune C+: Industry’s first True 3D In-Line Underfill & Conformal Coating Inspection Solution
- The industry’s first 3D in-line Dispense Process Inspection and thickness measurement solution for transparent material inspection.