Koh Young has declared that the company will be participate in Nepcon Asia 2021 at the Shenzhen Convention and Exhibition Center from August 25-27, 2021 in Shenzhen, China.
This grand exhibition spans 60,000 square meters with 900 exhibitors and is expected to reach pre-COVID attendee levels of over 60,000 visitors. Koh Young will exhibit award-winning solutions at booth 1F45 (Hall 1).
We will highlight nine smart factory solutions that solve electronics assembly challenges:
Neptune C+: Revolutionary True 3D In-Line Dispensing Process Inspection (DPI) Solution
- True 3D Profiling: Using patented technologies, the Neptune C+ is the industry’s first 3D inline DPI and thickness measurement solution for transparent material inspection.
- Bubble Inspection using AI-Powered Capabilities: With its proprietary machine learning technology, the Neptune C+ offers enhanced inspection capabilities enabling autonomous bubble inspection without teaching and endless tuning.
KY8030-3: The Industry’s Fastest True 3D Solder Paste Inspection Solution
- Automated Solder Paste Dispensing: The KY8030-3 automatically dispenses paste with its Auto-Rework option.
- Unmatched Inspection Speed: The KY8030-3 blends Koh Young’s pioneering technologies to provide unmatched inspection speeds.
Koh Young Printer Optimizer (KPO): AI-Powered solution for Printers
- Ultimate Printing Process Reliability & Consistency: With increasing component miniaturization, improving inspection quality, and increasing inspection systems throughput programming is paramount in the industry.
Meister S: Premium In-line 3D Inspection Systems for Ultra-thin Solder Paste Inspection
- Superior Flux Inspection: Combining innovative vision algorithms and high-resolution optics for the semiconductor industries, the Meister S goes beyond solder paste inspection.
- Market-proven Ultra-thin Solder Inspection: The Meister S has been qualified for mass production by major semiconductor foundries and micro-LED companies for solder inspection down to 10um with superior Full 3D inspection performance.
Meister D: The Industry’s Leading Inspection Systems for Advanced Packaging
- Crack Inspection: The Meister D is a solution targeting die and small MLCCs using an integrated measurement tool with defect analysis software based on advanced optics and AI engines.
Zenith F: The Industry’s Best-in-Class True 3D AOI Solution for FPCB Assembly
- FPCB Substrate Handling: The Zenith F is the ideal solution for high-volume FPCB inspection.
- True 3D Hotbar Inspection: The Zenith F is the industry’s only solution to base its inspection criteria on the IPC-610 standards using True 3D inspection performance for hotbar soldering.
Zenith Alpha: The Best Value 3D Automated Optical Inspection Solution
- KAP (Koh Young Auto Programming): The innovative geometry-based KAP software solution reduces the programming process to minimize time to production and reduces costs.
- Whole-board Foreign Material Inspection (WFMI): Inspection goes beyond components and solder joints.
KY-P3: Breakthrough in 3D Automated Pin Inspection Solutions
- Versatile Handling Mechanisms: Handling products at the back-end process has proven to be a challenge, yet Koh Young provides a perfect product lineup with versatile handling mechanisms
- KSMART Solutions: True Smart Factory Solution
- Turning Data into Insights: AI-powered KSMART solutions help automate process control while focusing on data management, analysis, and optimization.
- Converts Data into Knowledge for effective and quality-driven actions
- Deliver an AI-powered process analysis and optimization tool
- Achieve an autonomous process optimization facility