Limata has released the latest generation of its X3000 LDI system. This platform can handle the largest panels for dry-film patterning and solder mask imaging in PCB production without compromising on its highest precision standards in registration and resolution.
“With the X3000, we have built an impressive system that can handle even the biggest oversize boards, whilst still retaining the outstanding accuracy of our X1000 and X2000 models,” said Matthias Nagel, CTO of Limata. “Also, the X3000 also supports roll-to-roll for the handling of endless flexible boards, with the largest PCB manufactured so far measuring 25 meters in length.”
While standard PCB panel sizes have typically measured 24” x 18”, today there is an increasing demand for larger panels, often 24” x 36” or bigger, as well as a need to produce flexible PCBs in non-standard sizes. These large PCBs support a range of growing applications such as LED displays, 5G communications, aerospace and EV-automotive electronics. Using large PCBs instead of a combination of smaller boards delivers superior signal quality or lower signal attenuation in high-frequency applications, while at the same time noticeably reducing assembly and installation costs.
Being able to handle large panel formats, up to 110″ x 48″, also means that the X3000 can simultaneously image multiple smaller PCBs in a single run, for example, twelve standard 24″ x 18″ boards. This increases throughput, by reducing loading and unloading times, which further equates to reduced costs per panel. Also, work processes can be set flexibly in manufacturing locations, since the X3000 can be loaded and unloaded from the front- and back-side.