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Making History: Advanced System in a Package Technologies Enable Direct RF Conversion


RF data conversion systems are experiencing rapid changes as ADC and DAC performance specifications and form factors, along with new sensor technologies (Rx & Tx), continue to advance. One system level design problem has been consistent throughout—balancing the implementation tradeoffs between the analog and digital circuitry for maximum software/system flexibility (from sensor to the digital processing units’ input/ output). This fundamental problem requires the system designer to partition (or combine) the data conversion circuit components, along with analog and digital signal routing, that would allow for maximum softwarization for multiple implementation services. Now, as the future of advanced SiP (System-in-Package) assembly technologies accelerate data conversion system design implementations from hardware to software centricity; Teledyne e2v’s SiP design, development, and assembly expertise revolutionizes system level design for maximum flexibility and multi-mission capability. Using state-of-the-art technologies (flip chip, organic packages, etc.) for RF, Mixed-Signal, Digital Processing applications for use in: industrial, medical, avionic, instrumentation, telecommunication, military, and space applications are realized. Teledyne e2v’s 40+ years of experience in advanced SiP design and assembly technologies gives system designers the highest performance and value for advanced data conversion system platforms.


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Aishwarya Saxena

A book geek, with creative mind, an electronics degree, and zealous for writing.Creativity is the one thing in her opinion which drove her to enter into editing field. Allured towards south Indian cuisine and culture, love to discover new cultures and their customs. Relishes in discovering new music genres.

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