Maxim Presents Multi-Phase AI Power Chipset
Maxim Integrated has introduced multi-phase AI Power chipset MAX16602 AI cores dual-output voltage regulator and the MAX20790 smart power-stage IC.
Leveraging the current ripple cancelation benefit from Maxim Integrated’s patented coupled inductor, this AI multi-phase chipset provides a one percent efficiency improvement compared to competitive solutions, enabling greater than 95 percent efficiency at 1.8V output voltage and 200A load conditions.
“The real estate for AI power solutions is becoming limited while the need to provide high power density in a pre-designed small space is more critical. As a result, designers need a scalable solution to customize their design objectives,” said Steven Chen, director of business management for the Cloud and Data Center Business Unit at Maxim Integrated. “This multi-phase AI power chipset by Maxim Integrated powers AI hardware accelerators such as GPUs, FPGAs, ASICs and xPUs to increase solution efficiency and reduce solution size for different form factors such as PCIe and OAM.”
Furthermore, this increase in efficiency translates to a 16% reduction in wasted power. It also allows 40 percent less output capacitance compared to competitive solutions, reducing total solution size and capacitor count.
The chipset provides a scalable solution for various output current requirements and is customizable to support multiple form factors. In addition, the chipset enables AI computing at the edge as well as cloud computing at the data center.
Due to Maxim Integrated’s patented coupled inductor technology and monolithic integrated dual-side cooling power stage ICs, power loss is reduced as a result of a 50 percent lower switching frequency. The monolithic integrated approach practically eliminates the parasitic resistance and inductance between FETs and drivers to achieve the industry’s highest efficiency.
Key Advantages
- Highest Efficiency/Lowest Heat and Power Dissipation: Maxim Integrated’s patented coupled inductor technology reduces switching frequency by 50 percent, allowing for 1 percent higher efficiency
- Smallest Total Solution Size: A decrease in solution size is achieved by reducing output capacitance by 40 percent and providing a solution with lower phase count compared to competitive solutions
- Flexible: The solution is scalable from 2 to 16 phases for different output current requirements (thermal design current is typically 60A to 800A or more); Low profile (<4mm) coupled inductor is customizable to support multiple form factors such as peripheral component interconnect express (PCIe®) and OCP accelerator modules (OAM)
