MediaTek Achieves Breakthrough with 3nm Chip for 2024 Production
MediaTek and TSMC have announced that MediaTek has developed its first chip using TSMC’s leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC, with both companies taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high-performance and low-power features, empowering global end devices.
Joe Chen, President of MediaTek said, “We are committed to our vision of using the world’s most advanced technology to create cutting-edge products that improve our lives in meaningful ways. TSMC’s consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”
Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC said, “This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of the industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket. Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.“
TSMC’s 3nm process technology provides enhanced performance, power, and yield, in addition to complete platform support for both high-performance computing and mobile applications. Compared with TSMC’s N5 process, TSMC’s 3nm technology currently offers as much as 18% speed improvement at the same power, or 32% power reduction at the same speed, and approximately 60% increase in logic density.
