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Meeting Solder Paste Printing Challenges for SiP in “Smart” IoT Devices

Authored by: Sze Pei Lim, Kenneth Thum, Andy C. Mackie, Ph.D, MSc, Indium Corporation.

Introduction

System-in-package (SiP) is an increasingly important package type that comprises a variety of assembly materials and processes that minimizes volume, without sacrificing computational intensity. This market is mostly being driven by mobile Internet of Things (IoT) devices, such as smartphones and smartwatches. Materials deposition techniques, especially solder paste printing, are also changing to match this need.

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Nitisha Dubey

A diligent writer, who has been working from last five years in the same field. She has covered lots of event and expo for travel & judiciary, now covering technology. Book reading, exploring different destinations and varieties of cuisine are some hobbies. Love to watch biographies and historical movies.

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