Micron Technology has begun volume shipments of the world’s first 176-layer 3D NAND flash memory, achieving unprecedented, industry-pioneering density and performance.
Together, Micron’s new 176-layer technology and advanced architecture represent a radical breakthrough, enabling immense gains in application performance across a range of storage use cases spanning data center, intelligent edge and mobile devices.
“Micron’s 176-layer NAND sets a new bar for the industry, with a layer count that is almost 40% higher than our nearest competitors,” said Scott DeBoer, executive vice president of technology and products at Micron. “Combined with Micron’s CMOS-under-array architecture, this technology sustains Micron’s industry cost leadership.”
“Micron’s 176-layer NAND enables breakthrough product innovation for our customers,” said Sumit Sadana, executive vice president and chief business officer at Micron. “We are deploying this technology across our broad product portfolio to bring value everywhere NAND is used, targeting growth opportunities in 5G, AI, cloud and the intelligent edge.”
Representing Micron’s fifth generation of 3D NAND and second-generation replacement-gate architecture, it is the most technologically advanced NAND node in the market. Compared with the company’s previous generation of high-volume 3D NAND, Micron’s 176-layer NAND improves both read latency and write latency by more than 35% — dramatically accelerating application performance.
Featuring approximately 30% smaller die size than best-in-class competitive offerings, Micron’s 176-layer NAND’s compact design is ideal for solutions using small form factors.
With its versatile design and unrivaled density, Micron’s 176-layer NAND serves as an essential building block in technologists’ toolboxes across a broad array of sectors, including mobile storage, autonomous systems, in-vehicle infotainment, and client and data center solid-state drives (SSDs).
Micron is working with industry developers to quickly integrate the new products into solutions. To simplify firmware development, Micron’s 176-layer NAND offers a single-pass programming algorithm, enabling easier integration and speeding time to market.