Bosch has confirmed the launch of its new semiconductor factory in Dresden, Germany by the end of 2021.
This will act as a big milestone on the path to the chip factory of the future for German Tier 1 supplier Bosch, as its new semiconductor fab in Dresden, Germany silicon wafers are passing through the fully automated fabrication process for the first time.
Harald Kroeger, members of the board of management, Robert Bosch: “Chips for tomorrow’s mobility solutions and greater safety on our roads will soon be produced in Dresden. We plan to open our chip factory in the future before the year is out.”
“Our new wafer fab sets standards in automation, digitalization, and connectivity,” added Kroeger.
This the company says is a key step toward the start of production operations, which is scheduled for late 2021.
Manufacturing of automotive microchips will be a primary focus when Bosch’s fully digital and highly connected semiconductor plant is up and running.
The company already operates a semiconductor fab in Reutlingen near Stuttgart. The new wafer fab in Dresden is Bosch’s response to the surging number of areas of application for semiconductors. Tier 1 is investing around a billion euros (Rs 8,267 crore) in the high-tech manufacturing facility, which is said to be one of the most advanced wafer fabs in the world.
Funding for the new building is being provided by the federal German government, and more specifically the Federal Ministry for Economic Affairs and Energy. Bosch plans to officially open its wafer fab in June 2021.
In January 2021, Bosch began putting its first wafers through the fabrication process in Dresden. From there, the company will make power semiconductors for use in applications such as DC-DC converters in electric and hybrid vehicles.
In the six weeks it takes to produce the wafers, they undergo some 250 individual fabrication steps – all of which are fully automated.
The technology in focus at Bosch’s new Dresden facility is a 300-millimeter fabrication, in which a single wafer can accommodate 31,000 individual chips. The company says compared with conventional 150- and 200-millimeter wafers, this technology offers the company greater economies of scale and boosts its competitiveness in semiconductor production.