New Integration and Packaging Technologies for Autonomous Vehicles
CEA-Leti will present new integration and packaging technologies for next-generation LiDAR optical-network driving devices in autonomous vehicles at the Electronic Components and Technology Conference, May 30-June 2, in Orlando, Fla.
Presented in the paper, “Advanced 3D Integration TSV and Flip Chip Technologies Evaluation for the Packaging of a Mobile LiDAR 256-Channel Beam Steering Device Designed for Autonomous Driving Application”, the system was developed with the institute’s 3D microelectronics platform. Its 10µm-diameter mid-process through-silicon vias (TSVs) significantly improve interconnect density by distributing them on the whole backside surface of the devices. Combining 40µm fine-pitch, lead-free solder flip chip on a silicon interposer, this collective integration increases the performance and compactness of LiDARs, while lowering their cost for use in autonomous vehicles (AV). (Session 6, paper 7, Wednesday, May 31 @ 12:15 PM)
LiDAR sensors are considered to be a strong technology for ensuring safe AV driving because they can detect obstacles in the vehicle’s path and calculate their distance away. First-generation LiDARs were based on a mechanically generated steering beam and were much too large to be fully integrated in a vehicle. In this research work, steering concepts were developed using wafer-level silicon technology, including optical phase arrays. A 1,550nm wavelength beam was then brought into the circuit through grating couplers, then guided through silicon-oxide waveguides to the steering area. This provides precise, latency-free information on the position and speed of obstacles surrounding road transport vehicles, independently of light conditions and with sharp angular resolutions.
Along with other CEA-Leti presentations at ECTC, the paper illustrates the institute’s 3D interconnection expertise, primarily on its semiconductor wafer-level platform. System-in-package and 3D integration schemes enable mixing different technologies and/or substrate materials to address not only high-performance computing (HPC) applications requiring high-density interconnections, but also cost-sensitive applications, e.g. edge artificial intelligence and the Internet of Things (IoT).
“Our goals are to offer high-level of integration through high-density, fine-pitch interconnections to serve different requirements for a wide variety of applications,” said Sylvie Joly, partnerships manager for 3D integration & packaging at CEA-Leti. “Our labs’ wide range of advanced technologies complement each other; for example, hybrid-bonding such as die-to-wafer and wafer-to-wafer high interconnection density is closely linked to TSVs, to keep the density for further layer or ball grid array (BGA) connections.”