View Online March 16th, 2020 Hot Picks Powerful SoCs Turbocharge Wearables’ Future Just a few months after purchase, yesterday’s wearable was likely to be in a dusty drawer. However, new chips promise enhanced connectivity and compelling applications ensuring... With a Start of 2020, Fulfill your Expectation with New Trends As CES 2020 came to a close last week, we wanted to take a look at what to expect in 2020. The Consumer Electronics Show is... 5G Mouser Electronics Recognizes by TE Connectivity White Paper Factorized Power Architecture: Achieving high density and efficiency in board mounted power Author: Tom Curatolo, Principal Applications Engineer-Vicor As motherboard loads and load power began to increase and density became even more challenging, power systems architecture evolved from a distributed DC-DC converter (or Brick) to IBA (Intermediate Bus Architecture). With IBA, a converter steps the 48V input down to 12V and multiple niPOLs (non-isolated point-of-load regulators) buck... Products Mouser Electronics Recognizes by TE Connectivity Infineon Launches 5G Ready eSIM Turnkey Solution Microchip Launches a Range of Embedded IoT Solutions T&M Keysight Validates New Software Approach in Nokia’s 5G 5G Fuels Innovations in RF Test & Measurement Spirent Expands CyberFlood Data Breach Assessment Solution with Greater Capabilities A & D Military Drone Market Size to Reach USD 21.76 Billion by 2026 Teledyne e2v to Showcase its Semiconductor Solutions at Singapore Airshow 2020 Military Radar: Upgradation of Existing Systems and Equipment Will Ease Growth Process Telecom VIL Deploys a Charging Solution of Optiva Matrix to Participate in INDIA ELECTRONICS EXPO & INDIASOFT DOCOMO Releases White Paper Promoting 6G Communication System Security Another Global Pandemic We’re Not Talking About: Theft of IP Trend Micro Blocked 13 Million High-Risk Email Threats in 2019 © 2022 Bisinfotech. All Rights Reserved.