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April 24th, 2020
Hot Picks
The Impact of Industry 4.0
Author: Javed Ahmad, Senior Vice President, Global Supply Chain-India, Middle East & Africa, Schneider Electric India In the wake of the fourth industrial revolution, the world...
Powerful SoCs Turbocharge Wearables’ Future
Just a few months after purchase, yesterday’s wearable was likely to be in a dusty drawer. However, new chips promise enhanced connectivity and compelling applications ensuring...
5G
NXP Collaborates with Murata to Deliver Industry’s First RF
White Paper
Factorized Power Architecture: Achieving high density and efficiency in board mounted power
Author: Tom Curatolo, Principal Applications Engineer-Vicor As motherboard loads and load power began to increase and density became even more challenging, power systems architecture evolved from a distributed DC-DC converter (or Brick) to IBA (Intermediate Bus Architecture). With IBA, a converter steps the 48V input down to 12V and multiple niPOLs (non-isolated point-of-load regulators) buck...
Products
New Yorker Electronics Releases Vishay Infrared Sensor Modules
NXP Collaborates with Murata to Deliver Industry’s First RF
Micron Technology Integrates Motorola edge+ Smartphone
T&M
VIAVI Supports Service Providers and Network Equipment Manufacturers
Yokogawa Announces Completion of Acquisition with Fluid Imaging
Agilent Introduces New Handheld Raw Material ID System
A & D
NEC Wins a Deal of 20 Billion for a Satellite Supply
Inali Develops Smart Ventilator for COVID-19 Pandemic with Dassault Systèmes
Lockheed Releases Sixth Advanced Extremely High Frequency (AEHF-6) Satellite
Security
Check Point Offers Relief from Malware
Trend Micro Shares Research of Cloud Security
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