In the presence of Royal Dutch Couple – King Willem-Alexander & Queen Maxima and senior cabinet ministers of both the countries, NXP India signed Memorandum of Understanding (MoU) with HCL Technologies for next-gen advanced electronics and semiconductor products development.
The MoU signifies a strong technology collaboration between the two technology giants to co-develop the automotive product family for global automotive customers.
Speaking on the partnership, Sanjay Gupta, Vice-President & India Country Manager, NXP India, said, “Considering the transformations taking place in the industry, this MOU will be a win-win situation for both the companies, speeding up the semiconductor development and time to market. With the joint expertise, we would be able to solve the roadblocks swiftly and quickly to develop meaningful solutions in the areas of advanced automated connected cars and low power IOT applications to expand the Indian semiconductor ecosystem.”
“In line with the Indian government’s ‘Skill India’ initiative, this partnership will help in enhancing the product development skills of Indian engineers and they will get the opportunity to work on high-tech projects within the country”, he added.
NXP, with over 2,500 engineers in India, is involved in development of semiconductor hardware and software designs for the embedded market in various application segments like Automotive, Security & Connectivity, Digital Networking and next generation technological departments.
With the aim of providing safe and secure mobility, NXP has developed Advanced Driver Assistance Systems (ADAS) that aid drivers and help prevent accidents by leveraging technologies like radar, V2X (vehicle-to-everything communication) and lidar to perform functions like blind-spot monitoring, lane departure warning and parking assistance.
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