NXP Launches 2×2 Wi-Fi 6 + Bluetooth Solutions
NXP Semiconductors has released its family of 2×2 Wi-Fi 6 (802.11ax) Dual-Band + Bluetooth/BLE solutions that are driving a new phase of connectivity innovation for advanced gaming, audio, industrial and IoT markets.
“Today we’re delivering the industry’s leading 2×2 Wi-Fi 6 Dual-Band + Bluetooth solutions, enabling both the gaming industry and one of its most prominent console makers with Wi-Fi 6 for the first time,” said Rafael Sotomayor, Executive Vice President of Connectivity and Security at NXP. “This product announcement reinforces NXP’s position at the cutting edge of connectivity and our ability to enable advanced wireless capabilities for the future of gaming plus the exponential growth in Wi-Fi 6 access points and IoT devices tethered to a single gateway. Our IW62X family of integrated Wi-Fi 6 + Bluetooth solutions brings a step-change in high performance and power-efficient solutions for the latest generation of smart home IoT services, connected industrial applications and the vast number of consumer devices that rely on power-efficient Wi-Fi and Bluetooth connectivity to maximize the user experience.”
Enabling the world’s first Wi-Fi 6 enabled gaming console, NXP’s optimized IW62X family of products will provide increased capacity, efficiency and performance for next-generation connectivity solutions including smart consumer IoT hubs, wireless speakers, video-enabled smart devices, augmented and virtual reality (AR/VR) devices and a universe of additional IoT applications.
The new 2×2 Wi-Fi 6 solutions are ideal for advanced gaming consoles that demand high-performance Wi-Fi with near-zero wireless controller lag time and low-latency multiplayer gaming experiences (via a single, in-room console) over wireless networks. The IW62X solutions also offer real-time interactions for cloud-based gaming devices, clients and services by providing high-bandwidth and low-latency connectivity needed for full 4k / 60 fps game play.
The IW62X family features the highest level of integration in the market, including 2.4 and 5 GHz dual-band Power Amplifiers (PAs), Low Noise Amplifiers (LNAs) antenna switches. It also includes a power management unit that substantially reduces system-level BOM (Bill of Materials) and device board area. while also simplifying chip-on-board and integrated-module designs.
