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Peelable Technology Turns Everyday Objects into IoT Devices

Researchers have developed a new fabrication technique that uses a single wafer to build a nearly infinite number of thin film electronic circuits that are peelable from a surface.

Peelable Technology
Peelable electronic films can be cut and pasted onto any object to achieve desired functions.

The innovation on electronics is a step ahead with this new peelable technology in labs currently. The researcher at Purdue University and the University of Virginia has come up with technique has claimed to eliminate several manufacturing steps and associated costs, and allows any object to sense its environment or be controlled through the application of a high-tech sticker.

According to Purdue, the stickers could eventually facilitate wireless communication. The researchers demonstrate capabilities on various objects in a paper recently published in the Proceedings of the National Academy of Sciences.

“We could customise a sensor, stick it onto a drone, and send the drone to dangerous areas to detect gas leaks, for example,” said Chi Hwan Lee, Purdue Assistant Professor of Biomedical Engineering and Mechanical Engineering.
Electronic circuits are often individually built on their own silicon wafer, a flat and rigid substrate. The silicon wafer then withstands the high temperatures and chemical etching that are used to remove the circuits from the wafer.

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Jyoti Gazmer

A Mass Comm. graduate believes strongly in the power of words. A book lover who dreams to own a library some day. An introvert but will become your closest friend if you share mutual feelings about COFFEE. I prefer having more puppies over humans.

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