Pickering Interfaces to Showcase Testing Solutions at Space-Comm Expo
Pickering Interfaces will showcase its range of industry-standard modular signal switching and simulation products for electronic test and verification – including fault insertion and sensor simulation modules for Hardware-in-the-Loop simulation, and RF & microwave switching up to 110 GHz – on stand A46 at Space-Comm Expo 2025, at ExCeL in London, UK.
Space-Comm Expo is the largest and most influential event for the UK space industry. It attracts global leaders from NASA, the European Space Agency, and the United Nations, as well as delegates from across government, defence, aerospace and academia. Now entering its sixth year, the multi-award-winning Space-Comm Expo is supported by key industry associations and showcases technological developments and the end-to-end supply chain for products, services and applications servicing commercial enterprises, Government and defence organisations.
Pickering will showcase the following switching and simulation products, solutions and demos on stand A46 at Space-Comm Expo 2025:
- PXI/PXIe programmable precision resistor, RTD, thermocouple and LVDT/resolver modules for environmental sensor simulation.
- Fault insertion modules that can be used to switch signals between simulations and real-life devices.
- A 21-slot fully hybrid PXIe chassis and single-slot PXIe embedded controller.
- MEMS-based RF PXI & PXIe multiplexer family.
- A configurable PXI microwave switch platform that allows RF test engineers to combine a wide range of high-performance relay types while minimising chassis slot usage.
- Turnkey LXI microwave switch & signal routing subsystems – including a custom 12×12 LXI microwave switching matrix demo.
- A demo of their Microwave Switch Design Tool – a free online resource enabling engineers to easily design, simulate, and model PXI and LXI microwave switching systems.
Along with its switching and simulation solutions, Pickering will also show reed relays from its relay division and custom cable assemblies from its connectivity division.
