By navigating our site, you agree to allow us to use cookies, in accordance with our Privacy Policy.

Renesas’ Rad-Hard ICs Onboard Hayabusa2 Spacecraft

Renesas Electronics’ radiation-hardened (rad-hard) integrated circuits (ICs) were onboarded for the Hayabusa2spacecraft that returned asteroid samples to Earth in an armored re-entry capsule on December 6, 2020.

RenesasOperated by the Japan Aerospace Exploration Agency (JAXA), Hayabusa2 launched onboard the H-IIA rocket from the Tanegashima Space Center on December 3, 2014.

“Our industry-leading rad-hard ICs managed several Hayabusa 2 spaceflight subsystems,” said Philip Chesley, Vice President, Industrial and Communications Business Division at Renesas. “We are thrilled and honored to have played a key role in the Hayabusa2 six-year mission to help explain the origin of life on Earth and the birth of the solar system.”

Arriving at the Ryugu asteroid on June 27, 2018, the Hayabusa2 asteroid samples retrieval mission was designed to explore the origins of the planets, the water of Earth’s oceans and the source of life.

Hayabusa2 carried multiple science payloads for remote sensing and sampling, and its four small rovers investigated the asteroid surface and analyzed the environmental and geological context of the surface and subsurface samples collected.

Renesas’ Intersil-brand rad-hard ICs were deployed throughout the Hayabusa2 spacecraft.

The Renesas Intersil brand has a long history in the space industry spanning more than six decades, beginning with the founding of Radiation Inc. in 1950. Since then, virtually every satellite, shuttle launch and deep-space exploration mission have included Intersil-branded products.

Renesas leverages this experience to deliver efficient, thermally optimized and highly reliable SMD, MIL-STD-883 and MIL-PRF 38535 Class-V/Q Intersil-branded products for the defense, high-reliability (Hi-Rel), and rad-hard space markets. Renesas Intersil-brand rad-hard ICs support subsystems for mission-critical applications in data communications transfer, power supplies and power conditioning, general protection circuitry, and telemetry, tracking and control (TT&C).

Deep space is a challenging environment for spaceflight and asteroid exploration systems, particularly due to the intense radiation environment encountered in nearly all mission profiles.

Design, layout, certain process technologies, and manufacturing steps like burn-in and total dose testing of ICs ensure predictable performance and prevents system failure while in flight and on long-duration robotic and crewed missions to other planets.

Tags

Aishwarya Saxena

A book geek, with creative mind, an electronics degree, and zealous for writing.Creativity is the one thing in her opinion which drove her to enter into editing field. Allured towards south Indian cuisine and culture, love to discover new cultures and their customs. Relishes in discovering new music genres.

Related Articles

Upcoming Events