Rochester Electronics Earns IATF-16949 Letter of Conformance
The use of semiconductor electronics in automotive applications has expanded rapidly over the last few decades and continues to be one of the fastest-growing segments.
Rochester Electronics has received a letter of conformance, confirming its Quality Management System (QMS) complies with the requirements of the standard: IATF 16949:2016 for the Design and Manufacture of semiconductor components.
Obtaining this letter demonstrates Rochester’s commitment to providing customers with the highest standards of products and services within the automotive industry.
The use of semiconductor electronics in automotive applications has expanded rapidly over the last few decades and continues to be one of the fastest-growing segments.
Consequently, the semiconductor supply chain has now become integral to a manufacturer’s product planning. With a range of semiconductor manufacturing capabilities, Rochester Electronics supports its customers with individual services through to full turnkey manufacturing.
“We are extremely proud of our team for their work on achieving this milestone for the company. The requirements of the Automotive electronics industry align well with our capabilities and this sector represents a key element of our strategy for growth”, said Mike Dube, VP Manufacturing and Engineering, Rochester Electronics
Rochester Electronics is the world’s largest continuous source of semiconductors–100% Authorized by over 70 leading semiconductor manufacturers.
As an original manufacturer stocking distributor, Rochester has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and the broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types.
With over 12 billion die in stock, Rochester can manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
